學生李文輝(目前在成大機械所博士班)的文章
Title: PARAMETRIC STUDY OF FLIP-CHIP PACKAGING FOR AN MEMS DEVICE WITH DIAPHRAGM.
Author(s):Cheng-Hsin Chuang, Wen-Hui Li and Shin-Li Lee
in MICROSYSTEM TECHNOLOGIES DOI : 10.1007/s00542-010-1181-y.
學生蔡嵩玟的文章
Title: Fabrication of Multi-functional Optical Films by Using a UV-Curing Roll-to-Roll System
Author(s): C. H. Chuang, S. W. Tsai, J. F. Lin, C. P. Chen
accepted by Japanese Journal of Applied Physics (JJAP)
Thank you for your all efforts on these two Journal Paper.
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